Hysol E-3239
Hysol E-3239 was designed as a chemically resistant fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices.
| Applications |
Adhesives >
Photonics Adhesives >
Image Sensor & Camera Module Assembly, Thermal Cure Adhesives > Electrically Insulating Adhesives |
| Chemistry |
Epoxy based |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1188723 | 1188723 | Hysol E-3239 |
10.0 cc
|
|
| 1188724 | 1188724 | Hysol E-3239 |
30.0 cc
|
|
| 1188725 | 1188725 | Hysol E-3239 |
55.0 cc
|
