Hysol E-3239

Hysol E-3239 was designed as a chemically resistant fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices.


Applications Adhesives > Photonics Adhesives > Image Sensor & Camera Module Assembly, Thermal Cure
Adhesives > Electrically Insulating Adhesives
Chemistry Epoxy based
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol E-3239 'Epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1188723 1188723 Hysol E-3239
10.0 cc  
1188724 1188724 Hysol E-3239
30.0 cc  
1188725 1188725 Hysol E-3239
55.0 cc