Hysol E1172A
An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.
| Applications |
Adhesives >
Underfills >
CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board Adhesives > Underfills > Non-Reworkable CSP Underfill, Capillary Flow Potting & Encapsulating > Fill Materials |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
| IDH# | Item | Name | Size |
|
| 1204995 | 1204995 | Hysol E1172A 15G/10cc EFD w/ white piston/RC/OT |
|
|
| 1286202 | 1286202 | Hysol E1172A 40g/30cc EFD Syringe |
|
