Hysol E1172A

An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.


Applications Adhesives > Underfills > CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board
Adhesives > Underfills > Non-Reworkable CSP Underfill, Capillary Flow
Potting & Encapsulating > Fill Materials
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1204995 1204995 Hysol E1172A 15G/10cc EFD w/ white piston/RC/OT
 
1286202 1286202 Hysol E1172A 40g/30cc EFD Syringe