Hysol E1926
A non-reworkable, wafer-level underfill that provides excellent thermal reliability and cures relatively fast compared to standard first level underfills.
| Applications |
Adhesives >
Underfills >
Non-Reworkable CSP Underfill, Capillary Flow |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1187753 | 1187753 | Hysol E1926 10g EFD10 |
|
|
| 1187754 | 1187754 | Hysol E1926 10g PS10 |
|
