LOCTITE ECCOBOND E1926

(Known As Hysol E1926)

LOCTITE ECCOBOND E1926 is an non-reworkable, wafer-level underfill that provides excellent thermal reliability and cures relatively fast compared to standard first level underfills.


Applications Adhesives > Underfills > Non-Reworkable CSP Underfill, Capillary Flow
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol E1926 'Underfill Material'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1187753 0000001187753 LOCTITE ECCOBOND E 1926
(E-1926 EFD)
10.0 g Churn
10 / case
1187754 0000001187754 LOCTITE ECCOBOND E1926
(E-1926 IWASHITA TC02-2)
10.0 g Churn
10 / case
1293057 0000001293057 LOCTITE ECCOBOND E1926
(E-1926 EFD)
45.0 g cc
30 / case
1437436 0000001437436 LOCTITE ECCOBOND E 1926
(E-1926 IWASHITA TC02-2)
15.0 g cc
10 / case