Hysol ECCOBOND 104

A two component epoxy adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C.


Applications Adhesives > Electrically Non-Conductive Adhesives > Two Component
Potting & Encapsulating > PCB Protection Encapsulants - Potting > Epoxy Encapsulants-Potting, Two Component
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond 104 A/B 'Epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1187336 1187336 Hysol ECCOBOND 104 Part A BLK 10 OZ QUART
 
1187944 1187944 Hysol ECCOBOND 104 Part B 6.5 OZ QUART
 
1187945 1187945 Hysol ECCOBOND 104 Part A BLK 6LB 1.5 OZ
 
1187946 1187946 Hysol ECCOBOND 104 Part B 3LB 14.5 OZ GA
 
1187947 1187947 Hysol ECCOBOND 104 Part A BLK 30LB 7.5OZ
 
1187948 1187948 Hysol ECCOBOND 104 Part B 19LB 8.5 OZ PA
 
1205315 1205315 Hysol ECCOBOND 104 Part A BLACK 6 Lb+
 
1205316 1205316 Hysol ECCOBOND 104 Part B 3 Lb + 14.5
 
1286091 1286091 Hysol ECCOBOND 104 Part A 300gr Jar
 
1286092 1286092 Hysol ECCOBOND 104 Part B 200gr Jar
 
1295572 1295572 Hysol ECCOBOND 104 Part A 286gr