Hysol ECCOBOND 104
A two component epoxy adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives >
Two Component Potting & Encapsulating > PCB Protection Encapsulants - Potting > Epoxy Encapsulants-Potting, Two Component |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
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| 1187336 | 1187336 | Hysol ECCOBOND 104 Part A BLK 10 OZ QUART |
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| 1187944 | 1187944 | Hysol ECCOBOND 104 Part B 6.5 OZ QUART |
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| 1187945 | 1187945 | Hysol ECCOBOND 104 Part A BLK 6LB 1.5 OZ |
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| 1187946 | 1187946 | Hysol ECCOBOND 104 Part B 3LB 14.5 OZ GA |
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| 1187947 | 1187947 | Hysol ECCOBOND 104 Part A BLK 30LB 7.5OZ |
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| 1187948 | 1187948 | Hysol ECCOBOND 104 Part B 19LB 8.5 OZ PA |
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| 1205315 | 1205315 | Hysol ECCOBOND 104 Part A BLACK 6 Lb+ |
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| 1205316 | 1205316 | Hysol ECCOBOND 104 Part B 3 Lb + 14.5 |
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| 1286091 | 1286091 | Hysol ECCOBOND 104 Part A 300gr Jar |
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| 1286092 | 1286092 | Hysol ECCOBOND 104 Part B 200gr Jar |
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| 1295572 | 1295572 | Hysol ECCOBOND 104 Part A 286gr |
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