Hysol ECCOBOND 2332
Eccobond 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C.
| Applications |
Adhesives >
Electrically Insulating Adhesives Adhesives > Electrically Non-Conductive Adhesives > General |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
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| 1189735 | 1189735 | Hysol ECCOBOND 2332 10 KG |
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| 1189736 | 1189736 | Hysol ECCOBOND 2332 1 KG |
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| 1205295 | 1205295 | Hysol ECCOBOND 2332 370gm Jar |
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