Hysol ECCOBOND 2332

Eccobond 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C.


Applications Adhesives > Electrically Insulating Adhesives
Adhesives > Electrically Non-Conductive Adhesives > General
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond 2332 'Solventless epoxy adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1189735 1189735 Hysol ECCOBOND 2332 10 KG
 
1189736 1189736 Hysol ECCOBOND 2332 1 KG
 
1205295 1205295 Hysol ECCOBOND 2332 370gm Jar