Hysol ECCOBOND 59C

Two component, flexible, low temperature cure


Applications Adhesives > Electrically Conductive Adhesives
Adhesives > Industrial Bonding > Other - Flexible
Chemistry Electrically Conductive Paste
Media Carrier Solvent-based
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond 59C ''
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1188246 1188246 ECCOBOND 59C 454 GM JAR
 
1188247 1188247 ECCOBOND 59C 113 GM JAR
 
1205318 1205318 ECCOBOND 59C 113gm/Jar