Hysol ECCOBOND 59C
Two component, flexible, low temperature cure
| Applications |
Adhesives >
Electrically Conductive Adhesives Adhesives > Industrial Bonding > Other - Flexible |
| Chemistry |
Electrically Conductive Paste |
| Media Carrier | Solvent-based |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1188246 | 1188246 | ECCOBOND 59C 454 GM JAR |
|
|
| 1188247 | 1188247 | ECCOBOND 59C 113 GM JAR |
|
|
| 1205318 | 1205318 | ECCOBOND 59C 113gm/Jar |
|
