Hysol ECCOBOND 8177-0

Enhanced thermal conductivity, fast cure, low stress die and component attach adhesive optimized for GaAs MMIC attach.


Applications Adhesives > Electrically Conductive Adhesives
Adhesives > Electrically Conductive Adhesives > Heat Cure
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond 8177-0 'Heat cure epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1189775 1189775 Hysol ECCOBOND 8177-0 12,5