Hysol ECCOBOND 8177-0
Enhanced thermal conductivity, fast cure, low stress die and component attach adhesive optimized for GaAs MMIC attach.
| Applications |
Adhesives >
Electrically Conductive Adhesives Adhesives > Electrically Conductive Adhesives > Heat Cure |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1189775 | 1189775 | Hysol ECCOBOND 8177-0 12,5 |
|
