Hysol ECCOBOND A164-1
Enhanced thermal conductivity, fast cure, low stress die and component attach adhesive optimized for GaAs MMIC attach.
| Applications |
Adhesives >
Electrically Insulating Adhesives Adhesives > Electrically Non-Conductive Adhesives > General |
| Chemistry |
Non-Electrically Conductive Paste |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1205367 | 1205367 | Hysol ECCOBOND A164-1 4KG |
|
