Hysol ECCOBOND C850-6

Eccobond C850-6 is a fast curing, general conductive, one component, low viscosity, silver filled epoxy die attach adhesive paste. It features high electrical and thermal conductivity and high strength at wire bond temperatures.


Applications Adhesives > Die Attach Adhesives, Electrically Conductive
Adhesives > Electrically Conductive Adhesives > Heat Cure
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond C850-6 'Die Attach Epoxy '
PDF

Product information

IDH# Item Name Size
Case Quantity		 Material Safety Data Sheets
1188546 1188546 Hysol ECCOBOND C850-6 SP100 25GM/1OZ
 
1188547 1188547 Hysol ECCOBOND C850-6 SP100 4OZ/113
 
1188548 1188548 Hysol ECCOBOND C850-6 SP100 4OZ/240G
 
1205286 1205286 Hysol ECCOBOND C850-6 240gm/Jar
 
1205749 1205749 Hysol ECCOBOND C850-6 50g Jar
 
1205909 1205909 Hysol ECCOBOND C850-6 240gr Jar
 
1321665 1321665 Hysol ECCOBOND C850-6 25GM / 10CC SYRINGE
 


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