Hysol ECCOBOND C990

One-component, silver-filled epoxy adhesive.


Applications Adhesives > Electrically Conductive Adhesives > Heat Cure
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond C990 'Die attach'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1276473 1276473 Hysol ECCOBOND C990 J584(50g), Jar
 
1276474 1276474 Hysol ECCOBOND C990 J584(100g), Jar