Hysol ECCOBOND CA3150
Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.
| Applications |
Adhesives >
Electrically Conductive Adhesives >
Snap Cure |
| Chemistry |
Polyacrylates |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1188563 | 1188563 | Hysol ECCOBOND CA3150 30GM/10 CC EFD SY |
|
|
| 1313381 | 1313381 | Hysol ECCOBOND CA3150 20 GRAM/10CC SYRINGE |
|
