Hysol ECCOBOND CA3150

Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.


Applications Adhesives > Electrically Conductive Adhesives > Snap Cure
Chemistry Polyacrylates
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond CA3150 'Electrically conductive adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1188563 1188563 Hysol ECCOBOND CA3150 30GM/10 CC EFD SY
 
1313381 1313381 Hysol ECCOBOND CA3150 20 GRAM/10CC SYRINGE