Hysol ECCOBOND CA3152
Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.
| Applications |
Adhesives >
Electrically Conductive Adhesives >
Snap Cure |
| Chemistry |
Polyacrylates |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1188564 | 1188564 | Hysol ECCOBOND CA3152 30G/10 CC SY |
|
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| 1276347 | 1276347 | Hysol ECCOBOND CA3152 30g, 10cc Syringe |
|
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| 1316165 | 1316165 | Hysol ECCOBOND CA3152 12.5 GRAM / 5 CC SYRING |
|
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| 1337189 | 1337189 | Hysol ECCOBOND CA3152 5CC EFD SYRI |
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