Eccobond CE3103 is primarily designed for bonding polycarbonate to itself while not inducing stress cracking under typical molded stress levels. Eccobond CE3103 cures rapidly to form flexible, transparent bonds when exposed to ultraviolet light and/or visible light of sufficient irradiance and has shown excellent adhesion to a wide variety of substrates including glass, many plastics and most metals. The thixotropic nature of Eccobond CE3103 reduces the migration of liquid product after application to the substrate.

Applications Adhesives > Electrically Conductive Adhesives > Heat Cure
Adhesives > Industrial Bonding > Other - Flexible
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol CE3103 'Lead Free adhesive'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1188595 1188595 Hysol ECCOBOND CE3103 6GM/5CC