Hysol ECCOBOND CE3126

Snap curable anisotropic adhesive is especially suited in applications where throughtput is critical.  This product is typically used for very fine pitch flip chip interconnections where electrical conductivity is desired in only one direction.


Applications Adhesives > Electrically Conductive Adhesives > Snap Cure
Chemistry Adhesives
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol CE3126 'snap curable anisotropic adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1297371 1297371 Hysol ECCOBOND CE3126 10g/10cc EFD C
 
1324152 1324152 Hysol ECCOBOND CE3126 10 GRAM / 10 CC SYRINGE