Hysol ECCOBOND CE3126
Snap curable anisotropic adhesive is especially suited in applications where throughtput is critical. This product is typically used for very fine pitch flip chip interconnections where electrical conductivity is desired in only one direction.
| Applications |
Adhesives >
Electrically Conductive Adhesives >
Snap Cure |
| Chemistry |
Adhesives |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1297371 | 1297371 | Hysol ECCOBOND CE3126 10g/10cc EFD C |
|
|
| 1324152 | 1324152 | Hysol ECCOBOND CE3126 10 GRAM / 10 CC SYRINGE |
|
