Hysol ECCOBOND CE3535
One component epoxy adhesive paste providing high mechanical strength and stable contact resistance on Cu and 100% Sn.
| Applications |
Adhesives >
Electrically Conductive Adhesives >
Heat Cure Adhesives > Electrically Conductive Adhesives > Solder Alternative Electrically Conductive Paste |
| Chemistry |
Electrically Conductive Paste |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1276508 | 1276508 | Hysol ECCOBOND CE3535 (50GR), Jar |
|
