Hysol ECCOBOND CE8500

One component, general conductive, low stress adhesive for mismatched CTE applications. High thermal conductivity.


Applications Adhesives > Electrically Conductive Adhesives > Heat Cure
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond CE8500 'Solventless epoxy adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1188602 1188602 Hysol ECCOBOND CE8500 5 GM / 3 CC SY
 
1188603 1188603 Hysol ECCOBOND CE8500 25 GM / 10 CC SY
 
1189573 1189573 Hysol ECCOBOND CE8500 10C
 
1189574 1189574 Hysol ECCOBOND CE8500 25
 
1189575 1189575 Hysol ECCOBOND CE8500 12,
 
1189577 1189577 Hysol ECCOBOND CE8500 25 GM / 10 C
 
1189578 1189578 Hysol ECCOBOND CE8500 5 G
 
1232869 1232869 Hysol ECCOBOND CE8500 10cc EFD seringas