Hysol ECCOBOND CE8500
One component, general conductive, low stress adhesive for mismatched CTE applications. High thermal conductivity.
| Applications |
Adhesives >
Electrically Conductive Adhesives >
Heat Cure |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1188602 | 1188602 | Hysol ECCOBOND CE8500 5 GM / 3 CC SY |
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| 1188603 | 1188603 | Hysol ECCOBOND CE8500 25 GM / 10 CC SY |
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| 1189573 | 1189573 | Hysol ECCOBOND CE8500 10C |
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| 1189574 | 1189574 | Hysol ECCOBOND CE8500 25 |
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| 1189575 | 1189575 | Hysol ECCOBOND CE8500 12, |
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| 1189577 | 1189577 | Hysol ECCOBOND CE8500 25 GM / 10 C |
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| 1189578 | 1189578 | Hysol ECCOBOND CE8500 5 G |
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| 1232869 | 1232869 | Hysol ECCOBOND CE8500 10cc EFD seringas |
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