Hysol ECCOBOND DX-20C

Eccobond DX-20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.


Applications Adhesives > Die Attach Adhesives, Electrically Non-Conductive
Adhesives > Electrically Non-Conductive Adhesives > General
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond DX-20C 'Dielectric adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1363063 0000001363063 LOCTITE ABLESTIK DX20C
(ECCOBOND DX-20C 0.03kg)
 
1387251 0000001387251 LOCTITE ABLESTIK DX20C
(ECCOBOND DX-20C 0.1Kg)
 
1205285 1205285 Hysol ECCOBOND DX-20C 4/100gm/Jar
 
1205378 1205378 Hysol ECCOBOND DX-20C 3_100GR
 
1205379 1205379 Hysol ECCOBOND DX-20C 4_100GR
 
1276451 1276451 Hysol ECCOBOND DX-20C 30g/,30cc Musashi