Hysol ECCOBOND E1470

B-stage capable adhesive designed for component and lid attach applications. Bonds well to engineering plastics such as LCP, as well as silicon and metals such as aluminum.


Applications Adhesives > Electrically Non-Conductive Adhesives > General
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol E1470 'Heat cure epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1188700 1188700 Hysol ECCOBOND E1470 10g/10cc EFD