Hysol ECCOBOND E1470
B-stage capable adhesive designed for component and lid attach applications. Bonds well to engineering plastics such as LCP, as well as silicon and metals such as aluminum.
Electrically Non-Conductive Adhesives >
|Media Carrier||100 % liquid & paste|
|Cure Type||Heat cure|
|RoHS Compliant||Contact Henkel|
Technical Data Sheets (TDS)
|1188700||1188700||Hysol ECCOBOND E1470 10g/10cc EFD||