Hysol ECCOBOND E3200

A very fast and low temperature curing one component adhesive with good flexibility, chemical and humidity resistance.


Applications Adhesives > Electrically Non-Conductive Adhesives > Cure Type
Adhesives > Industrial Bonding > Other - Flexible
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond E3200 'Heat Curing adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1188715 1188715 Hysol ECCOBOND E3200 10 GM/10CC SYR
 
1188716 1188716 Hysol ECCOBOND E3200 35GM/30CC EFD S
 
1188717 1188717 Hysol ECCOBOND E3200 35G/30CC EFD SY W/Orange
 
1188718 1188718 Hysol ECCOBOND E3200 50GM/6 OZ CART
 
1188719 1188719 Hysol ECCOBOND E3200 6 OZ SEMCO DP C
 
1190103 1190103 Hysol ECCOBOND E3200 200
 
1190105 1190105 Hysol ECCOBOND E3200 35 G
 
1286133 1286133 Hysol ECCOBOND E3200 35g/30cc Syrin
 
1286207 1286207 Hysol ECCOBOND E3200 10g/10cc Syrin