Hysol ECCOBOND E3200
A very fast and low temperature curing one component adhesive with good flexibility, chemical and humidity resistance.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives >
Cure Type Adhesives > Industrial Bonding > Other - Flexible |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
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| 1188715 | 1188715 | Hysol ECCOBOND E3200 10 GM/10CC SYR |
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| 1188716 | 1188716 | Hysol ECCOBOND E3200 35GM/30CC EFD S |
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| 1188717 | 1188717 | Hysol ECCOBOND E3200 35G/30CC EFD SY W/Orange |
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| 1188718 | 1188718 | Hysol ECCOBOND E3200 50GM/6 OZ CART |
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| 1188719 | 1188719 | Hysol ECCOBOND E3200 6 OZ SEMCO DP C |
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| 1190103 | 1190103 | Hysol ECCOBOND E3200 200 |
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| 1190105 | 1190105 | Hysol ECCOBOND E3200 35 G |
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| 1286133 | 1286133 | Hysol ECCOBOND E3200 35g/30cc Syrin |
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| 1286207 | 1286207 | Hysol ECCOBOND E3200 10g/10cc Syrin |
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