Hysol ECCOBOND E3503-1

Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely affect solder processes.


Applications Adhesives > Electrically Non-Conductive Adhesives
Adhesives > Die Attach Adhesives, Electrically Non-Conductive
Adhesives > Thermally Conductive Adhesives > Non-Shimming Adhesives
Adhesives > Thermally Conductive Adhesives > Thermally Conductive Paste
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond E3503-1 'Heat Cure Epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1188732 1188732 Hysol ECCOBOND E3503-1 25GM/30 CC EFD SY