Hysol ECCOBOND E3503-1
Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely affect solder processes.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives Adhesives > Die Attach Adhesives, Electrically Non-Conductive Adhesives > Thermally Conductive Adhesives > Non-Shimming Adhesives Adhesives > Thermally Conductive Adhesives > Thermally Conductive Paste |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1188732 | 1188732 | Hysol ECCOBOND E3503-1 25GM/30 CC EFD SY |
|
