Hysol ECCOBOND E6752

A one component, low temperature cure, surface mount adhesive that can be applied easily without stringing.


Applications Adhesives > Chipbonder / Surface Mount Adhesives > Dispense Film
Chemistry Adhesives
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond E6752 'Surface Mount Adhesive For Very High Speed Dispensing'
PDF

Product information

IDH# Item Name Size
Case Quantity		 Material Safety Data Sheets
1189564 1189564 Hysol ECCOBOND E6752 10CC
 
1189565 1189565 Hysol ECCOBOND E6752 30 G
 


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