Hysol ECCOBOND E8502-1

This low modulus, thermally conductive, modified epoxy adhesive is ideally suited for management of large CTE mismatch & bonding of stress sensitive components.

Technical Information

Applications	Adhesives > Electrically Non-Conductive Adhesives Adhesives > Thermally Conductive Adhesives > Non-Shimming Adhesives Adhesives > Thermally Conductive Adhesives > Thermally Conductive Paste
Chemistry	Adhesives
Media Carrier	100 % liquid & paste
Cure Type	Heat cure
RoHS Compliant	Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond E8502-1 'Solventless modified epoxy adhesive'

PDF

English

Product information

IDH#	Item	Name	Size Case Quantity	Material Safety Data Sheets
1189776	1189776	Hysol ECCOBOND E8502-1 33		1189776 (us/en)
1189777	1189777	Hysol ECCOBOND E8502-1 10		1189777 (us/en)

Top

Quick Links