Hysol ECCOBOND E8502-1

This low modulus, thermally conductive, modified epoxy adhesive is ideally suited for management of large CTE mismatch & bonding of stress sensitive components.

Applications Adhesives > Electrically Non-Conductive Adhesives
Adhesives > Thermally Conductive Adhesives > Non-Shimming Adhesives
Adhesives > Thermally Conductive Adhesives > Thermally Conductive Paste
Chemistry Adhesives
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond E8502-1 'Solventless modified epoxy adhesive'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1189776 1189776 Hysol ECCOBOND E8502-1 33
1189777 1189777 Hysol ECCOBOND E8502-1 10