Hysol ECCOBOND S-3869
Thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives >
General Adhesives > Die Attach Adhesives, Electrically Non-Conductive |
| Chemistry |
Epoxy based |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| eccobonds-3869_idh | eccobonds-3869 | Hysol ECCOBOND S-3869 |
|
