Hysol ECCOBOND S-3869

Thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.


Applications Adhesives > Electrically Non-Conductive Adhesives > General
Adhesives > Die Attach Adhesives, Electrically Non-Conductive
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond S-3869 'Thermosetting dielectric adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
eccobonds-3869_idh eccobonds-3869 Hysol ECCOBOND S-3869