Hysol ECCOBOND TE3530

One component, low temperature curing thermally conductive epoxy adhesive.


Applications Adhesives > Thermally Conductive Adhesives > Non-Shimming Adhesives
Adhesives > Thermally Conductive Adhesives > Thermally Conductive Paste
Thermal Management Materials > Phase Change - Thermal Interface Materials
Chemistry Thermally Conductive Paste - non-shimming
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond TE3530 'Heat cure epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1276619 1276619 Hysol ECCOBOND TE3530 25g/10cc Musashi