Hysol ECCOBOND UV9085

Designed as a faster curing, high thixotropic adhesive that gives good flow control and adhesion for a thick bondline.


Applications Potting & Encapsulating > Dam Materials
Potting & Encapsulating > Glob Top Materials > Glob Top Materials, UV Cure
Chemistry Polyacrylates
Media Carrier 100 % liquid & paste
Cure Type UV and light cure
RoHS Compliant Contact Henkel

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1189127 1189127 Hysol ECCOBOND UV9085 10 CC SY