Hysol ECCOBOND UV9085
Designed as a faster curing, high thixotropic adhesive that gives good flow control and adhesion for a thick bondline.
| Applications |
Potting & Encapsulating >
Dam Materials Potting & Encapsulating > Glob Top Materials > Glob Top Materials, UV Cure |
| Chemistry |
Polyacrylates |
| Media Carrier | 100 % liquid & paste |
| Cure Type | UV and light cure |
| RoHS Compliant | Contact Henkel |
| IDH# | Item | Name | Size |
|
| 1189127 | 1189127 | Hysol ECCOBOND UV9085 10 CC SY |
|
