Hysol EO1086

Hysol EO1086 is a one-component heat cure encapsulant designed for use in Chip on Board applications requiring excellent handling properties.

 


Applications Adhesives
Potting & Encapsulating > Fill Materials > Fill Materials - Chip-on-Board
Potting & Encapsulating > Glob Top Materials > Glob Top Materials, Thermal Cure
Potting & Encapsulating > Glob Top Materials > Glob Top Materials - Chip-on-Board
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol EO1086 'Epoxy Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1161983 1161983 Hysol EO1086
1.0 gal