Hysol EO1088

One component encapsulants potting epoxy.


Applications Potting & Encapsulating > Glob Top Materials
Potting & Encapsulating > PCB Protection Encapsulants - Potting > Epoxy Encapsulants-Potting, One Component
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol EO1088 'Epoxy Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
763241 763241 Hysol EO1088 B50 5kg