Hysol FF2200

Hysol® FluxFill™ FF2200 is a reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach. The material is formulated to provide the required flux for eutectic solder joint formation. It also provides the necessary environmental protection and stress distribution properties required by advanced assembly and packaging applications.


Applications Adhesives > Underfills > No Flow for Small Die
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FF2200 'Reflow Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
803581 803581 Hysol FF2200