Hysol FF2200
Hysol® FluxFill™ FF2200 is a reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach. The material is formulated to provide the required flux for eutectic solder joint formation. It also provides the necessary environmental protection and stress distribution properties required by advanced assembly and packaging applications.
| Applications |
Adhesives >
Underfills >
No Flow for Small Die |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 803581 | 803581 | Hysol FF2200 |
|
