Hysol FF2300

Hysol FF2300 is a no-flow underfill for eutectic and lead-free applications.


Applications Adhesives > Underfills
Adhesives > Underfills > No Flow for Small Die
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FF2300 'Reflow Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
627014 627014 Hysol FF2300 10cc No Flow Underfill
 
792851 792851 Hysol FF2300