Hysol® FP0114™ is a low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications. It has excellent wettability and adhesion to the typical surfaces encountered in flip chip applications. It can be applied to ceramic or organic substrates, including solder masks and polyimide. Due to the combination of properties FP0114 is ideal for high reliability applications.
CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board
Adhesives > Underfills > Flip-Chip on Flex Capillary
Technical Data Sheets (TDS)