Hysol FP0114

Hysol® FP0114™ is a low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications. It has excellent wettability and adhesion to the typical surfaces encountered in flip chip applications. It can be applied to ceramic or organic substrates, including solder masks and polyimide. Due to the combination of properties FP0114 is ideal for high reliability applications.


Applications Adhesives > Underfills > CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board
Adhesives > Underfills > Flip-Chip on Flex Capillary
Chemistry Epoxies
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FP0114 'Epoxy underfill'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
973539 973539 Hysol FP0114