Hysol FP4323
Hysol FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications.
| Applications |
Potting & Encapsulating >
Dam Materials Potting & Encapsulating > Glob Top Materials > Glob Top Materials, Thermal Cure |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
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| 397703 | 397703 | Hysol FP4323 6 OZ. FROZ Encapsulant |
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| 452110 | 452110 | Hysol FP4323 35cc FP4323 |
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| 467120 | 467120 | Hysol FP4323 10 cc FP4323 |
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| 498503 | 498503 | Hysol FP4323 10 cc FP4323 |
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| 498511 | 498511 | Hysol FP4323 30 cc FP4323 |
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| 498513 | 498513 | Hysol FP4323 10 cc FP4323 |
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| 667287 | 667287 | Hysol FP4323 30 cc FP4323 |
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| 452111 | FP4323V25 | Hysol FP4323 30cc FP4323 |
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