Hysol FP4323

Hysol FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications.


Applications Potting & Encapsulating > Dam Materials
Potting & Encapsulating > Glob Top Materials > Glob Top Materials, Thermal Cure
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FP4323 'Liquid Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
397703 397703 Hysol FP4323 6 OZ. FROZ Encapsulant
 
452110 452110 Hysol FP4323 35cc FP4323
 
467120 467120 Hysol FP4323 10 cc FP4323
 
498503 498503 Hysol FP4323 10 cc FP4323
 
498511 498511 Hysol FP4323 30 cc FP4323
 
498513 498513 Hysol FP4323 10 cc FP4323
 
667287 667287 Hysol FP4323 30 cc FP4323
 
452111 FP4323V25 Hysol FP4323 30cc FP4323