Hysol FP4410HF

Hysol FP0087 is low stress fill for potting automated sensor and diodes, high Tg.


Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol® Hysol® FP4410HF 'Liquid Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
397700 397700 Hysol FP4410HF 20 oz Low Visc FP4410HF