Hysol FP4450

Hysol FP4450 is an industry standard fill material for fill or cavity down BGAs.


Applications Potting & Encapsulating > Fill Materials > Fill Materials - Chip-on-Board
Potting & Encapsulating > Glob Top Materials > Glob Top Materials - Chip-on-Board
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FP4450 'Semiconductor Liquid Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1089538 1089538 Hysol FP4450 30cc SEMI Encapsulant w/ Mylar Bag
 
397706 397706 Hysol FP4450 10 cc Semiconductor Encapsulant
 
449641 449641 Hysol FP4450 50 cc Semiconductor Encapsulant
 
498591 498591 Hysol FP4450 6 OZ. Semiconductor Encapsulant
 
498608 498608 Hysol FP4450 10 cc Semiconductor Encapsulant
 
498610 498610 Hysol FP4450 30 cc Iwashita syringe Semiconductor Encapsulant,
 
498611 498611 Hysol FP4450 30 cc EFD syringe Semiconductor Encapsulant
 
498624 498624 Hysol FP4450 30 cc S/C Encapsulant w/ WHMIS
 
447234 FP4450-V25 Hysol FP4450 Semiconductor Encapsulant 30cc