Hysol FP4450
Hysol FP4450 is an industry standard fill material for fill or cavity down BGAs.
| Applications |
Potting & Encapsulating >
Fill Materials >
Fill Materials - Chip-on-Board Potting & Encapsulating > Glob Top Materials > Glob Top Materials - Chip-on-Board |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
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| 1089538 | 1089538 | Hysol FP4450 30cc SEMI Encapsulant w/ Mylar Bag |
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| 397706 | 397706 | Hysol FP4450 10 cc Semiconductor Encapsulant |
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| 449641 | 449641 | Hysol FP4450 50 cc Semiconductor Encapsulant |
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| 498591 | 498591 | Hysol FP4450 6 OZ. Semiconductor Encapsulant |
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| 498608 | 498608 | Hysol FP4450 10 cc Semiconductor Encapsulant |
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| 498610 | 498610 | Hysol FP4450 30 cc Iwashita syringe Semiconductor Encapsulant, |
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| 498611 | 498611 | Hysol FP4450 30 cc EFD syringe Semiconductor Encapsulant |
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| 498624 | 498624 | Hysol FP4450 30 cc S/C Encapsulant w/ WHMIS |
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| 447234 | FP4450-V25 | Hysol FP4450 Semiconductor Encapsulant 30cc |
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