Hysol FP4460

Hysol FP4460 is a high purity, low stress glob top semiconductor encapsulant with improved moisture resistance and working life compared to earlier generation products.


Applications Potting & Encapsulating > Fill Materials
Potting & Encapsulating > Glob Top Materials > Glob Top Materials, Thermal Cure
Potting & Encapsulating > Glob Top Materials > Glob Top Materials - Chip-on-Board
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FP4460 'Glop Top Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
498674 498674 Hysol FP4460 Glob Top Semi Encapsulant, 30 cc Luerlok white piston
 
498675 498675 Hysol FP4460 Glob Top Semi Encapsulant, 10 cc w/ WHMIS
 
498688 498688 Hysol FP4460 Glob Top Semi Encapsulant, 30 cc Semco syringe
 
602793 602793 Hysol FP4460 Glob Top Semi Encapsulant, 6 oz
 
710377 710377 Hysol FP4460
 
397709 FP4460V24 Hysol FP4460 Glob Top Semi Encapsulant, 10 cc Luerlok blk tip/PE piston
 
452116 FP4460V25 Hysol FP4460 Glob Top Semi Encapsulant, 30 cc EFD Blue tip cap