Hysol FP4470
High adhesion version of FP4450 for 260°C L3 JEDEC performance.
| Applications |
Potting & Encapsulating >
Fill Materials >
Fill Materials - Chip-on-Board |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 468135 | 468135 | Hysol FP4470 IC Encapsulant 30cc |
|
|
| 555621 | 555621 | Hysol FP4470 IC Encapsulant 6 oz |
|
|
| 556652 | 556652 | Hysol FP4470 IC Encapsulant 10cc |
|
|
| 556692 | 556692 | Hysol FP4470 IC Encapsulant 30cc w/ WHMIS |
|
|
| 601159 | 601159 | Hysol FP4470 IC Encapsulant 50 cc |
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