Hysol FP4470

High adhesion version of FP4450 for 260°C L3 JEDEC performance.


Applications Potting & Encapsulating > Fill Materials > Fill Materials - Chip-on-Board
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FP4470 'Liquid Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
468135 468135 Hysol FP4470 IC Encapsulant 30cc
 
555621 555621 Hysol FP4470 IC Encapsulant 6 oz
 
556652 556652 Hysol FP4470 IC Encapsulant 10cc
 
556692 556692 Hysol FP4470 IC Encapsulant 30cc w/ WHMIS
 
601159 601159 Hysol FP4470 IC Encapsulant 50 cc