Hysol FP4526

Hysol FP4526 epoxy underfill is designed for capillary flow on flip chip applications.


Applications Adhesives > Underfills > CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board
Adhesives > Underfills > Flip-Chip on Flex Capillary
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FP4526 'Flip Chip Underfill Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1050776 1050776 Hysol FP4526 12 oz
 
397712 397712 Hysol FP4526 10 cc
 
498732 498732 Hysol FP4526 10 cc w/ WHMS
 
498738 498738 Hysol FP4526 55cc
 
452117 FP4526-V19 Hysol FP4526 30cc