Hysol FP4530
Hysol FP4530 is snap cure flip chip underfill for FC on flex. Designed for gap size down to 25 microns.
| Applications |
Adhesives >
Underfills >
CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board Adhesives > Underfills > Flip-Chip on Flex Capillary |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 397714 | 397714 | Hysol FP4530 10 cc |
|
|
| 498759 | 498759 | Hysol FP4530 30 cc |
|
|
| 556695 | 556695 | Hysol FP4530 8cc |
|
|
| 584327 | 584327 | Hysol FP4530 8cc fill in 10 cc |
|
|
| 633727 | 633727 | Hysol FP4530 6cc fill in 10 cc |
|
|
| 984214 | 984214 | Hysol FP4530 6cc fill in 20 cc |
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