Hysol FP4530

Hysol FP4530 is snap cure flip chip underfill for FC on flex. Designed for gap size down to 25 microns.


Applications Adhesives > Underfills > CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board
Adhesives > Underfills > Flip-Chip on Flex Capillary
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FP4530 'Flip Chip Underfill Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
397714 397714 Hysol FP4530 10 cc
 
498759 498759 Hysol FP4530 30 cc
 
556695 556695 Hysol FP4530 8cc
 
584327 584327 Hysol FP4530 8cc fill in 10 cc
 
633727 633727 Hysol FP4530 6cc fill in 10 cc
 
984214 984214 Hysol FP4530 6cc fill in 20 cc