Hysol FP4531

Hysol FP4531 is a snap cure fast flow underfill for CSP applications.


Applications Adhesives > Underfills > CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board
Adhesives > Underfills > Flip-Chip on Flex Capillary
Adhesives > Underfills > Non-Reworkable CSP Underfill, Capillary Flow
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FP4531 'Flip Chip Underfill Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
379965 379965 Hysol FP4531 30 cc
 
446513 446513 Hysol FP4531 10CC LL/BLK TIP/PE PISTON WHT
 
498773 498773 Hysol FP4531 55 cc
 
510066 510066 Hysol FP4531 10 CC MUSHASHI W/CLR PISTON & END CAP
 
518791 518791 Hysol FP4531 10CC LL/BLK TIP/PE PISTON WHT
 
633765 633765 Hysol FP4531 6cc fill in 10 cc syringe
 
684249 684249 Hysol FP4531 2cc fill in 3 cc syringe
 
846271 846271 Hysol FP4531 30 cc w/ WHMIS