Hysol FP4549

Hysol FP4549 is used for fine-pitch flip chip applications, fast flowing, low stress underfill.


Applications Adhesives > Underfills > High Lead Packages DSP Processor, ASICs Capillary
Adhesives > Underfills > Flip-Chip on Flex Capillary
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol FP4549 'Flip Chip Underfill Encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1061024 1061024 Hysol FP4549 6 oz
 
1061025 1061025 Hysol FP4549 30CC BLACK SPIKE TIP, WHITE PISTON
 
379968 379968 Hysol FP4549 30CC BLACK SPIKE TIP, WHITE PISTON
 
498801 498801 Hysol FP4549 20 oz
 
498809 498809 Hysol FP4549 10cc w/ WHMIS
 
450741 FP4549V20 Hysol FP4549 10CC LL/BLK TIP/PE PISTON WHT