Hysol FP4585

High purity,flip-chip underfill, high Pb and no-Pb applications


Applications Adhesives > Underfills > High Lead Packages DSP Processor, ASICs Capillary
Adhesives > Underfills > Pb-Free Packages Capillary
Adhesives > Underfills > Over-Molded Flip-Chip Capillary
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol FP4585 'Epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1302089 fp4585 Hysol FP4585
 


Additional Documents

Challenging Flip Chip Applications No Problem for New Underfill Technology
PDF