Hysol FP5000

Hysol® FP5000™ is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints and provides resistance to thermal cycling. The product conforms with JEDEC Level 1, 260 °C requirement. It can be used on Laminate Packages CSP, SCSP, SIP.

Applications Adhesives > Electrically Non-Conductive Adhesives
Adhesives > Underfills > Electrically Non-Conductive Paste Encapsulants - Thermal Compression
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol FP5000 'Non-Conductive Paste'