Hysol® FP5000™ is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints and provides resistance to thermal cycling. The product conforms with JEDEC Level 1, 260 °C requirement. It can be used on Laminate Packages CSP, SCSP, SIP.
Electrically Non-Conductive Adhesives
Adhesives > Underfills > Electrically Non-Conductive Paste Encapsulants - Thermal Compression
|Media Carrier||100 % liquid & paste|
|Cure Type||Heat cure|
|RoHS Compliant||Contact Henkel|