Hysol FP5001

Hysol FP5001 is one part with excellent thermal cycling resistance. Compatible with both constant and pulse heat tools. Recommended for gold / gold assembly joint. For use on Laminate Packages CSP, SCSP, SIP.


Applications Adhesives > Thermally Conductive Adhesives
Adhesives > Underfills > Electrically Non-Conductive Paste Encapsulants - Thermal Compression
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1021850 1021850 Hysol FP5001 10cc
10.0 cc