Hysol FP5001
Hysol FP5001 is one part with excellent thermal cycling resistance. Compatible with both constant and pulse heat tools. Recommended for gold / gold assembly joint. For use on Laminate Packages CSP, SCSP, SIP.
| Applications |
Adhesives >
Thermally Conductive Adhesives Adhesives > Underfills > Electrically Non-Conductive Paste Encapsulants - Thermal Compression |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
| IDH# | Item | Name | Size |
|
| 1021850 | 1021850 | Hysol FP5001 10cc |
10.0 cc
|
