Hysol FP5201

Designed for thermal compression bonding processes in flip chip to laminate assembly. Laminate Packages CSP, SCSP, SIP


Applications Adhesives > Underfills > Electrically Non-Conductive Paste Encapsulants - Thermal Compression
Adhesives > Underfills > Over-Molded Flip-Chip Capillary
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol FP5201 'Thermal Compression Bonding Adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity		 Material Safety Data Sheets
fp5201_idh fp5201 Hysol FP5201
 


Additional Documents

Enabling Next-Generation Copper Pillar IC Technology, New NCP from Henkel also Compatible with Overmolding (Cu Pillar FP5201)
PDF
Henkel’s Hysol FP5201 NCP Enables New Copper Pillar Interconnect Technology
PDF
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