Hysol FP5300
Hysol FP5300 has excellent adhesion strength to 2- and 3-layer flex and Iaminates. Low temp cure ACP. For use on RFID, Misc, Assembly.
| Applications |
Adhesives >
Thermally Conductive Adhesives Adhesives > Underfills > Electrically Non-Conductive Paste Encapsulants - Thermal Compression |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1060847 | 1060847 | Hysol FP5300 5cc EFD |
|
