Hysol FP5300

Hysol FP5300 has excellent adhesion strength to 2- and 3-layer flex and Iaminates. Low temp cure ACP. For use on RFID, Misc, Assembly.


Applications Adhesives > Thermally Conductive Adhesives
Adhesives > Underfills > Electrically Non-Conductive Paste Encapsulants - Thermal Compression
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol FP5300 'Epoxy Adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1060847 1060847 Hysol FP5300 5cc EFD