Hysol FP5500

Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly).


Applications Adhesives > Underfills > Electrically Non-Conductive Paste Encapsulants - Thermal Compression
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
fp5500_idh fp5500 Hysol FP5500