Hysol GR725LS

Hysol GR725LS is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature.


Applications Molding Compounds > Semiconductor Molding Compounds > Surface Mount / Lead Frames
Molding Compounds > PCB Molding Compounds
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
gr725ls_idh gr725ls Hysol GR725LS