Hysol GR725LS
Hysol GR725LS is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds >
Surface Mount / Lead Frames Molding Compounds > PCB Molding Compounds |
| Chemistry |
Epoxy based |
| RoHS Compliant | Contact Henkel |
| IDH# | Item | Name | Size |
|
| gr725ls_idh | gr725ls | Hysol GR725LS |
|
