Hysol GR750-SC
A high thermal conductivity molding compound using fully rounded spherical crystalling fillers designed to improve thermal management for semiconductor devices. It exhibits high adhesion to Cu and Cu alloys. This material is specifically recommended for isolated power transistors.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds >
Through-Hole Discretes, High Thermal Conductivity |
| Chemistry |
Epoxy based |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| gr750-sc_idh | gr750-sc | Hysol GR750-SC |
|
