Hysol GR869
Green, ultra low stress and high adhesion molding compound designed for QFP packages with Pb-free finishing. Provides wide molding process window and robust reliability performance.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds >
Surface Mount / Lead Frames Molding Compounds > Semiconductor Molding Compounds > Green Molding Compounds |
| Chemistry |
Epoxy based |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| gr869_idh | gr869 | Hysol GR869 |
|
