Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled. This material exhibits ultra low warpage. Hysol® GR9810-1 is a “green” (non Antimony/ Bromine/Phosphorous) molding compound and is capable of achieving JEDEC Level 2 requirements (substrate dependent), at 260ºC reflow temperature.
Molding Compounds > Semiconductor Molding Compounds
Molding Compounds > PCB Molding Compounds
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