Hysol Huawei KL-G900H

Hysol® Huawei KL-G900H™ is a high adhesion, ultra low stress, green mold compound suitable for BGA and contains no bromine, antimony or phosphorus flame retardant. It’s low viscosity properties enables low wire sweep molding with a large operating window.


Applications Molding Compounds > Semiconductor Molding Compounds
Molding Compounds > PCB Molding Compounds
RoHS Compliant Contact Henkel