Hysol Huawei KL-G900H
Hysol® Huawei KL-G900H™ is a high adhesion, ultra low stress, green mold compound suitable for BGA and contains no bromine, antimony or phosphorus flame retardant. It’s low viscosity properties enables low wire sweep molding with a large operating window.
Molding Compounds >
Semiconductor Molding Compounds
Molding Compounds > PCB Molding Compounds
|RoHS Compliant||Contact Henkel|